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refactor: divide others page into csq and resources
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sayanee committed Mar 27, 2024
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2 changes: 1 addition & 1 deletion _includes
2 changes: 1 addition & 1 deletion _layouts
Submodule _layouts updated 3 files
+11 −0 csq.html
+1 −1 default.html
+7 −0 resources.html
56 changes: 56 additions & 0 deletions csq.md
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---
layout: csq
title: CSQ
permalink: /csq
sequence: 7

# Lessons
lessons:
- title: Lessons learnt
subtitle: Good practices to continue for future projects
list:
- name: Add functional logical blocks in schematic to use similar circuits in future versions or other projects
- name: Use stencil SMD soldering with SMD components only if it is necessary. Else, use a PCB assembly service.
- name: Use minimum number of through-hole components
- name: Check Gerber file format with the PCB manufacturer before rendering them
- name: Check <code>F.Paste</code> and <code>B.Paste</code> layers for SMD stencil pattern
- name: Pull out every single MCU pin as a test point for the first version of the project.
- name: Always buy buffer number of components. Image is from the book Designing Electronics That Work by Hunter Scott.
image: buffer-components.png

- title: Enclosure
subtitle: Next iteration improvements
list:
- name: Make the PCB routing symmetrical for LED positions and connector slots
- name: Ensure the length is not too long to prevent bending of the material
- name: Use wider ventilation holes with wider spacing between each of them
- name: Use less clearance for connector slots. Take note of finger access
- name: Use other shapes for connector slots E.g. rounded corner or trapezoid
- name: Use shape binder for seperation plane bends
- name: Use a counter sunk screw head
- name: Make the screw lug's initial length be wider to contain the screw head so that it can sink into the surface
- name: Try a snap-fit enclosure

- title: V2.0
subtitle: For next iteration
list:
- name: Use SMD components only on top layer for one-step manual SMD stencil soldering process
- name: Place a writable area on the silkscreen to note down LoRa node address, PCB number, frequency or other info
- name: Add a <a href="https://sg.element14.com/c/test-measurement/test-connectors-ic-clips/pcb-test-points?connector-mounting=surface-mount">surface mount PCB test point</a> for <code>VBAT</code>, <code>VBUS</code>, <code>3.3V</code>, <code>5V</code>, <code>GND</code> and SPI points.
- name: Use a smaller <code>SSD1306</code> I2C OLED display instead of E-Ink. It's cheaper and easier to source and buy.

- title: Board bring-up
list:
- name: Check with 3 PCBs to conclude whether it is a design issue or a soldering / manufacturing / assembly issue
- name: Power it with current limiting power supply unit only. Check all the power test points such as <code>VBAT</code>, <code>VBUS</code>, <code>3.3V</code>, <code>5V</code>, <code>GND</code>.

# Schedule
design_start: '2019-11-05'
design_end: '2021-05-20'
manufacturing_start: '2021-05-24'
manufacturing_end: '2021-06-10'
integration_start: '2021-06-21'
integration_end: '2021-12-31'
deployment_start: '2022-01-01'
deployment_end: '2022-02-15'
---
53 changes: 2 additions & 51 deletions others.md → resources.md
Original file line number Diff line number Diff line change
@@ -1,49 +1,9 @@
---
layout: others
title: Others
permalink: /others
title: Resources
permalink: /resources
sequence: 7

# Lessons
lessons:
- title: Lessons learnt
subtitle: Good practices to continue for future projects
list:
- name: Add functional logical blocks in schematic to use similar circuits in future versions or other projects
- name: Use stencil SMD soldering with SMD components only if it is necessary. Else, use a PCB assembly service.
- name: Use minimum number of through-hole components
- name: Check Gerber file format with the PCB manufacturer before rendering them
- name: Check <code>F.Paste</code> and <code>B.Paste</code> layers for SMD stencil pattern
- name: Pull out every single MCU pin as a test point for the first version of the project.
- name: Always buy buffer number of components. Image is from the book Designing Electronics That Work by Hunter Scott.
image: buffer-components.png

- title: Enclosure
subtitle: Next iteration improvements
list:
- name: Make the PCB routing symmetrical for LED positions and connector slots
- name: Ensure the length is not too long to prevent bending of the material
- name: Use wider ventilation holes with wider spacing between each of them
- name: Use less clearance for connector slots. Take note of finger access
- name: Use other shapes for connector slots E.g. rounded corner or trapezoid
- name: Use shape binder for seperation plane bends
- name: Use a counter sunk screw head
- name: Make the screw lug's initial length be wider to contain the screw head so that it can sink into the surface
- name: Try a snap-fit enclosure

- title: V2.0
subtitle: For next iteration
list:
- name: Use SMD components only on top layer for one-step manual SMD stencil soldering process
- name: Place a writable area on the silkscreen to note down LoRa node address, PCB number, frequency or other info
- name: Add a <a href="https://sg.element14.com/c/test-measurement/test-connectors-ic-clips/pcb-test-points?connector-mounting=surface-mount">surface mount PCB test point</a> for <code>VBAT</code>, <code>VBUS</code>, <code>3.3V</code>, <code>5V</code>, <code>GND</code> and SPI points.
- name: Use a smaller <code>SSD1306</code> I2C OLED display instead of E-Ink. It's cheaper and easier to source and buy.

- title: Board bring-up
list:
- name: Check with 3 PCBs to conclude whether it is a design issue or a soldering / manufacturing / assembly issue
- name: Power it with current limiting power supply unit only. Check all the power test points such as <code>VBAT</code>, <code>VBUS</code>, <code>3.3V</code>, <code>5V</code>, <code>GND</code>.

# References
similar:
- name: LilyGO TTGO T-Beam
Expand Down Expand Up @@ -254,13 +214,4 @@ references:
- name: How to Solder Castellated Mounting Holes
url: https://learn.sparkfun.com/tutorials/how-to-solder-castellated-mounting-holes/all

# Schedule
design_start: '2019-11-05'
design_end: '2021-05-20'
manufacturing_start: '2021-05-24'
manufacturing_end: '2021-06-10'
integration_start: '2021-06-21'
integration_end: '2021-12-31'
deployment_start: '2022-01-01'
deployment_end: '2022-02-15'
---

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