Release v5.5.0 · renesas/fsp

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.5.0.

Minimum e2 studio version for FSP 5.5.0 is e2 studio 2024-07

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_5_0_e2s_v2024-07.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_5_0_e2s_v2024-07.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v5_5_0_e2s_v2024-07.pkg, from here.

If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.

For Windows download setup_fsp_v5_5_0_rasc_v2024-07.exe from here
For Linux download setup_fsp_v5_5_0_rasc_v2024-07.AppImage from here
For macOS (Apple Silicon) download setup_fsp_v5_5_0_rasc_v2024-07.pkg from here

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

Arm GNU Toolchain: 13.2

LLVM Embedded Toolchain for Arm: 18.1.3

IAR Compiler: 9.50.2

ARM Compiler: 6.21

QE for Capacitive Touch: 3.5.0

QE for Display: 3.2.0

Renesas E2 and E2 Lite: 2.1.3

SEGGER J-Link: 7.98b

Contributor License Agreement

Added CONTRIBUTING.md file to Github repository containing guidelines for community contributions to FSP.
- Note: We now require community contributors to sign a Contributor License Agreement (CLA). If you or your organization haven't previously signed, a bot comment will prompt you to sign the CLA when you create a pull request.

New Features

Added support for the following boards:
- VK-RA8M1
- VOICE-RA2L1
- VOICE-RA4E1
- VOICE-RA6E1
OSPI/DOTF: Added support for wrapped AES keys
DA14531/DA14535: Added support for Legacy Pairing, Just Works, and Passkey pairing methods as well as initiating pairing from the Peripheral side
Block Media RAM middleware now supports SDRAM and other memory-mapped RAM devices
SCI UART driver now supports IrDA communication on supported devices
Added support for lwIP (lightweight TCP/IP) stack
Added support for ZMOD4510 NO2 O3 sensor
Support Dual Bank mode for Flash LP with MCUboot
Added LittleFS support for external Flash
Added support for GM02S LTE module
- GM cellular modules are a direct replacement for RYZ. As such, certain EWF and AWS cellular interface usage notes will now reference GM instead of RYZ. Some support for RYZ nomenclature has been retained for compatibility purposes.

Fixes and Improvements

MCUBoot updated to 2.1.0
Arm Mbed TLS updated to 3.6.0
FreeRTOS+TCP updated to 4.2.1
Segger JLink version updated to 7.98b
CMSIS-DSP updated to 1.16.2
RA8x1 Updates to clocks tab
- Updated the tooltip for ICLK and PCLKs to match the description in the hardware manual
- RA8T1 Removed unsupported clocks from clock tree (LCDCLK, U60CK, OCTASPICLK)
- Added missing PLL divider option (PLL Div / 4)
Additional code size optimizations for TML32 and SAU UART drivers on RA0E1
Fixed AC6/LLVM warning in rm_motor_driver (Implicit conversion from float to uint16_t)
Fixed issue in AC6 linker scripts where extra RAM was being allocated for non-secure buffers in NetX projects on devices that don't support TrustZone.
RA2A2 Fixed issue where the LOCO could be selected as a clock source for RTC (Only Sub-Clock is available)
RA0E1 Fixed issue where the weekday field was not being calculated in the r_rtc module.
IICA Fixed build warning in generated code when SDLA and SDAA pins were disabled.
IICA Fixed issue where transfers were not aborted after receiving a NACK
Fixed build errors when 'Enable inline BSP IRQ functions' setting is enabled on CM4 devices
Fixed write value of unused mask invalid bits in r_can driver (applies to FIFO mode only)
Fixed unresolvable constraint when multiple I3C stacks are added
Added warnings for certain invalid clock configurations on some devices
Fixed invalid Developer Assistance callback entry for SAU UART
CTSU: Fixed issue with capacitive touch filter
Fixed issue with upgrade mode (Direct XIP) using MCUboot and internal code flash
Fixed issue with CEU capture
Fixed TRNG drawing excessive current after use when placed in power down
DSI: Fixed virtual channel ID for HS sequence operations
Common FSP API support updated to v1.7.0
Update MQTT usage notes
IAR EW projects now correctly select size-based optimization for RA0E1 projects by default
SMBus now provides unique error codes for different timeout events via rm_comms_callback_args_t::p_instance_args

Deprecations

FS2012 and OB1203 sensor modules
RYZ cellular modules
ZMOD4410 "Odor" mode
ZMOD4510 "OAQ 1st Gen" mode

Known Issues

RA0E1:
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
  - Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
- HS400x, ZMOD4xxx and OB1203 sensors cannot be used on RA0E1
- FS1015 and FS3000 sensors do not support SAU-I2C driver
Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
PMSC may not work properly when USBX Composite Device(PCDC+PMSC) is connected to specific Linux OS (USB Host).