diff --git a/_includes b/_includes
index d1007be..de68b8c 160000
--- a/_includes
+++ b/_includes
@@ -1 +1 @@
-Subproject commit d1007beeda991ecffdcbb01b5813e82a3d1cfc09
+Subproject commit de68b8c8a25d7fda46853fa61a4b47b7b8d3e5db
diff --git a/_layouts b/_layouts
index 662222c..495050d 160000
--- a/_layouts
+++ b/_layouts
@@ -1 +1 @@
-Subproject commit 662222c40b4346d1c6089066c674d080107a5172
+Subproject commit 495050db967ceadae2fd509ccb2ec5ef4a531e63
diff --git a/csq.md b/csq.md
new file mode 100644
index 0000000..b2e3375
--- /dev/null
+++ b/csq.md
@@ -0,0 +1,56 @@
+---
+layout: csq
+title: CSQ
+permalink: /csq
+sequence: 7
+
+# Lessons
+lessons:
+ - title: Lessons learnt
+ subtitle: Good practices to continue for future projects
+ list:
+ - name: Add functional logical blocks in schematic to use similar circuits in future versions or other projects
+ - name: Use stencil SMD soldering with SMD components only if it is necessary. Else, use a PCB assembly service.
+ - name: Use minimum number of through-hole components
+ - name: Check Gerber file format with the PCB manufacturer before rendering them
+ - name: Check F.Paste
and B.Paste
layers for SMD stencil pattern
+ - name: Pull out every single MCU pin as a test point for the first version of the project.
+ - name: Always buy buffer number of components. Image is from the book Designing Electronics That Work by Hunter Scott.
+ image: buffer-components.png
+
+ - title: Enclosure
+ subtitle: Next iteration improvements
+ list:
+ - name: Make the PCB routing symmetrical for LED positions and connector slots
+ - name: Ensure the length is not too long to prevent bending of the material
+ - name: Use wider ventilation holes with wider spacing between each of them
+ - name: Use less clearance for connector slots. Take note of finger access
+ - name: Use other shapes for connector slots E.g. rounded corner or trapezoid
+ - name: Use shape binder for seperation plane bends
+ - name: Use a counter sunk screw head
+ - name: Make the screw lug's initial length be wider to contain the screw head so that it can sink into the surface
+ - name: Try a snap-fit enclosure
+
+ - title: V2.0
+ subtitle: For next iteration
+ list:
+ - name: Use SMD components only on top layer for one-step manual SMD stencil soldering process
+ - name: Place a writable area on the silkscreen to note down LoRa node address, PCB number, frequency or other info
+ - name: Add a surface mount PCB test point for VBAT
, VBUS
, 3.3V
, 5V
, GND
and SPI points.
+ - name: Use a smaller SSD1306
I2C OLED display instead of E-Ink. It's cheaper and easier to source and buy.
+
+ - title: Board bring-up
+ list:
+ - name: Check with 3 PCBs to conclude whether it is a design issue or a soldering / manufacturing / assembly issue
+ - name: Power it with current limiting power supply unit only. Check all the power test points such as VBAT
, VBUS
, 3.3V
, 5V
, GND
.
+
+# Schedule
+design_start: '2019-11-05'
+design_end: '2021-05-20'
+manufacturing_start: '2021-05-24'
+manufacturing_end: '2021-06-10'
+integration_start: '2021-06-21'
+integration_end: '2021-12-31'
+deployment_start: '2022-01-01'
+deployment_end: '2022-02-15'
+---
diff --git a/others.md b/resources.md
similarity index 76%
rename from others.md
rename to resources.md
index 026d52a..25c9334 100644
--- a/others.md
+++ b/resources.md
@@ -1,49 +1,9 @@
---
layout: others
-title: Others
-permalink: /others
+title: Resources
+permalink: /resources
sequence: 7
-# Lessons
-lessons:
- - title: Lessons learnt
- subtitle: Good practices to continue for future projects
- list:
- - name: Add functional logical blocks in schematic to use similar circuits in future versions or other projects
- - name: Use stencil SMD soldering with SMD components only if it is necessary. Else, use a PCB assembly service.
- - name: Use minimum number of through-hole components
- - name: Check Gerber file format with the PCB manufacturer before rendering them
- - name: Check F.Paste
and B.Paste
layers for SMD stencil pattern
- - name: Pull out every single MCU pin as a test point for the first version of the project.
- - name: Always buy buffer number of components. Image is from the book Designing Electronics That Work by Hunter Scott.
- image: buffer-components.png
-
- - title: Enclosure
- subtitle: Next iteration improvements
- list:
- - name: Make the PCB routing symmetrical for LED positions and connector slots
- - name: Ensure the length is not too long to prevent bending of the material
- - name: Use wider ventilation holes with wider spacing between each of them
- - name: Use less clearance for connector slots. Take note of finger access
- - name: Use other shapes for connector slots E.g. rounded corner or trapezoid
- - name: Use shape binder for seperation plane bends
- - name: Use a counter sunk screw head
- - name: Make the screw lug's initial length be wider to contain the screw head so that it can sink into the surface
- - name: Try a snap-fit enclosure
-
- - title: V2.0
- subtitle: For next iteration
- list:
- - name: Use SMD components only on top layer for one-step manual SMD stencil soldering process
- - name: Place a writable area on the silkscreen to note down LoRa node address, PCB number, frequency or other info
- - name: Add a surface mount PCB test point for VBAT
, VBUS
, 3.3V
, 5V
, GND
and SPI points.
- - name: Use a smaller SSD1306
I2C OLED display instead of E-Ink. It's cheaper and easier to source and buy.
-
- - title: Board bring-up
- list:
- - name: Check with 3 PCBs to conclude whether it is a design issue or a soldering / manufacturing / assembly issue
- - name: Power it with current limiting power supply unit only. Check all the power test points such as VBAT
, VBUS
, 3.3V
, 5V
, GND
.
-
# References
similar:
- name: LilyGO TTGO T-Beam
@@ -254,13 +214,4 @@ references:
- name: How to Solder Castellated Mounting Holes
url: https://learn.sparkfun.com/tutorials/how-to-solder-castellated-mounting-holes/all
-# Schedule
-design_start: '2019-11-05'
-design_end: '2021-05-20'
-manufacturing_start: '2021-05-24'
-manufacturing_end: '2021-06-10'
-integration_start: '2021-06-21'
-integration_end: '2021-12-31'
-deployment_start: '2022-01-01'
-deployment_end: '2022-02-15'
---