CDPnP Instructions (translation in progress, unfinished)

[dukelec]

Calibration instructions video: https://youtu.be/i8R95j60-6I
SMT work video: https://youtu.be/3ZsayoO3BOo
Tray & Tape SMT Test: https://youtu.be/XLXNkeP19Ng

Install

Packing list

In addition to the main machine, the package also contains

• One 35V 2A power adapter
• A DC power adapter board and power adapter cable
• One acrylic version of CDBUS-Bridge (USB to RS485)
• One RS485 gray data cable
• The main unit has a 502 ceramic nozzle already installed, and a 506 rubber nozzle is provided
• 3 trays
• 1 package of anti-slip film

Replace nozzle

By default, the 502 nozzle is designed to pick up 0402 components, but smaller and larger components can also be picked up, such as 0201 components, LQFP48 chips, and even larger components.

The 502 nozzle can suck very large chips, but it tends to slip during rotation, resulting in an incorrect angle, which can be corrected manually.

If you want to change the nozzle, it is recommended to hold the R-axis motor by hand during operation to prevent the platform where the R-axis motor is located from bending and deforming.

Replace the anti-slip film

On the bottom board of the machine, a 3mm thick silicone pad (length and width 130x300mm) has been attached, which can play the effect of soft light, protection and anti-slip.
However, components placed directly on the silicone pad will be stuck by the silicone pad and difficult to uptake, so the left side of the silicone pad will be affixed with a special anti-slip film.
The anti-slip film can balance both the component anti-slip and the component can be picked up.
The machine is shipped with a anti-slip film by default. When you need to clean it, it is recommended to wipe gently with a paper towel moistened with water.

If the anti-slip surface is broken, we can replace the film.

Anti-slip film is actually an office product - card protector film

We take out a pair of card protectors and cut off the root where the adhesive is stuck. Then we wipe the silicone sheet with a paper towel moisten

Tip.
We can also cut out a piece of 2mm thick acrylic board (recommended winter melon white, both sides are glossy), paste a layer of 1 ~ 2mm thickness of silicone pad on it, and then paste card protection film on the top.
This way, when the SMT operation starts, you can put the acrylic card with the components directly onto the silicone, and prepare another acrylic card during the SMT operation.

(The card in the picture below is missing the silicone sheet and needs additional silicone sheet.)

It is recommended to use a small section of resistor or capacitor paper carrier tape to disperse the components, as well as flip, the following video for the 0402 resistor flip operation (larger resistors will be more difficult, you can also use tweezers to flip):

flip_resistors.mp4

Pouring the components directly on the large silicone board is sometimes not very easy to handle. It is recommended to pour the material on a small card first, and then transfer the components from the card to the silicone board with a paper carrier tape.
Especially when the previous component is in the process of mounting operation, using this method can prepare the next component at the same time to save time.

Power on and calibration

When the 12V power is connected, each MCU board will blink green, then the green light will stay lit and the machine will remain stationary.
The backlight board can be manually controlled by the backlight board switch at the lower left corner of the machine.

Connect to USB, see the CD-PnP installation instructions, install the Python dependency environment, and then run the main Python program of CD-PnP.
After the program starts, the machine will normally perform a zeroing operation and stop after zeroing, at which point you can follow the program terminal prompts to open the CD-PnP software web graphical interface.
(If the machine is already powered up and zeroed, starting the CD-PnP program again will not perform the zeroing operation.)

power_on.mp4

Once the web interface is open, you can control the machine movement with the keyboard (you can also use the corresponding buttons on the web interface to move):

The data in the GUI interface is automatically saved after modification and will not be lost when the page is refreshed.

Preset height adjustment for calibration jobs

If a machine configuration file with the corresponding number is supplied from the factory, the user can choose to skip this step by importing it in the web interface via the Import Config button.

The web interface has a set of User pos columns available to the user, the purpose of which is to quickly move to the previously saved coordinates by clicking on the corresponding Goto button.

By default 2 groups of position shortcuts have been filled in, one is to run to an empty position, near the middle of the machine, more without interfering with the user's operations such as loading and unloading components and boards.
The other is the initial position of the calibration job, to which you have to go first when performing a nozzle position calibration.

However, if the height of the initial position of the calibration operation is not the ideal height, it will affect the subsequent calibration operation, so we have to calibrate this height first when we use the machine for the first time, and we almost don't need to repeat this process later.
The operation method is as follows.

First click the Goto button of Calibration, go to the initial position of the calibration operation, check the Enable option after Camera to turn on the camera, the default is to turn on the No.1 main camera, and you can choose None for the component detection method to keep the screen clean.

At this point, we can press the <- button after Grab offset (0°) to move the nozzle to the left above the black crosshair, switch to camera 2, and select the Light option to turn on the camera backlight.

detect the height of the glass piece where the black cross cursor is located. After the automatic stop, select speed 2 and move the nozzle up 3 times to lift the nozzle (increase the height by 0.3mm), so that the nozzle and the glass piece are closer together, but at a distance that does not touch.

At this stage, the height is almost calibrated, and the next step is to store this height in the Calibration shortcut.

• In the current position, press the Cur + cam dz button to increase the Z-axis height by the corresponding height of Camera delta z, the default is 7mm, usually no need to change.
• Press -Grab offset (0°) followed by -> button to move the main camera to the right above the black cross cursor glass piece to switch to the main camera screen. It does not matter if the camera center mark and the black cross cursor do not overlap.
• Press the Update button after User pos in Calibration to update and save the Calibration coordinates.

Calibration

....

Caution

• Be sure to connect other cables first, and then plug or unplug the 35V power supply last.

• Components that have been exposed to solder paste may not be picked up by the nozzle if the solder paste is not cleaned up when used again.

• If there is no solder paste on the PCB corresponding to the component pads, 0402 or smaller components may continue to stick to the nozzle after the air pump stops working, interfering with the next placement.

• When the machine is moving, try to wait for it to stop before sending other movement commands to prevent mutual interference. (When there is no other task, you can quickly press the direction key several times, or long press the direction key. When the movement speed is 4, then slow down a little.)

• When replacing the nozzle, hold the rotary axis motor by hand to prevent deformation of the platform where the rotary axis motor is located or damage to the force sensor strain gauge.

• Clean the place where you put the material and the PCB with a wet paper towel before use: to avoid stain interference with visual recognition; and to prevent the PCB from shifting easily when the nozzle is pressed if it is not sticking firmly.

• When placing the PCB, the back is not attached to the components, press hard to the silicone board to prevent movement during SMT.

• If the back of the PCB has been soldered components, it is recommended to use multiple components of the highest to flatten the PCB. Then use adhesive tape to stick the PCB to the silicone board to prevent movement during placement.

• When SMT, if you feel that the PCB has moved causing inaccuracy, you can pause or stop the task to recheck and correct the position of the two calibration points.

• When removing the PCB, it is recommended to remove the PCB slowly from one corner because the silicone board is sticky.

• When touching the machine, avoid directly touching the exposed circuit board of the machine, try to touch the metal frame or PCB screws first to prevent ESD from damaging the machine.

• From the factory, the camera lens has been adjusted to focus and added soft rubber to prevent loosening, if it does not focus, it may be the wrong camera height, not try to screw the lens to focus.

• If the PCB surface is particularly dirty, the screen will have a lot more details, the jpg image taken by the camera will become much larger, and the current transmission speed between mcu and camera is not fast enough, which may lead to broken images.

• If the ambient light is too strong to affect the visual detection, it is recommended to find ways to reduce the ambient light, such as closing some curtains, especially the strong light shining into the room from outdoors.

• The machine should be placed on a flat work surface, pay attention to the location of the bottom soft foot pad do not set on debris.

• When the motor is locked, changing the nozzle may cause the R-axis motor to lose step and rotate to other angles, so it should be re-powered to find the zero point, otherwise the nozzle calibration data will be inaccurate next time.

• The machine has position overrun protection, but currently there is no dead zone protection for camera 2, so be careful not to hit camera 2.

• If the Z-axis is not in Detect bottom mode, it will automatically return to the top if the Z-axis is accidentally pressed down and hits something with too much pressure. (Try to be careful not to hit anything.)

• The nozzle should not touch the #2 camera throughout the nozzle calibration process, and the user should avoid touching the #2 camera (except for very light paper towels) to prevent changes in the #2 camera position from affecting the accuracy of the calibration.

• Avoid lowering the nozzle that does not pick up the component onto the PCB solder paste as much as possible to prevent the nozzle from becoming clogged with solder paste. In case of blockage or sticky solder paste, it is recommended to clean it in time.

• To carry out 0201 device placement, if the air humidity is low and there is a lot of static electricity, it is recommended that the operator body connect a wire to the GND of the machine adapter, and also clean the gripping area with a wet paper towel before the placement, which can avoid the device being blown away by static electricity and lead to gripping failure.

• If you want to reload the machine into the box, after power up first go to the default Idle position, and then with 4-speed movement, to the right and backward each 2 times.

The use of tape to fix the PCB during the backside placement operation demonstration:
(crossed tape can prevent movement, and note that the bottom of the inductors with the same height to pad the pcb to horizontal)

Working area:
When using a Tray, the remaining area where the PCB can be placed is as follows in the dashed area: